Dear CAMM Members:
As the CAMM builds momentum, its funded projects will generate intellectual property assets. In order to facilitate your awareness and evaluation of inventions made in CAMM-funded projects, this “members only” Webpage contains the Reports of Invention sent to designated corporate representatives in the process outlined in the CAMM Member Agreements. CAMM Full and Affiliate Members can obtain a royalty-free, non-exclusive license to CAMM inventions by exercising your option in writing within ninety (90) days of receiving the Report of Invention and committing to cover patenting costs. Additional information about the posted inventions is available on request, subject to a confidentiality agreement.
CAMM Participating Members are also invited to view the listed technologies, access to which may be negotiated on the expiration of the 90-day Election Period.
We look forward to working with you.
CAMM-Funded Inventions
| Count | Date Reported | Title |
Inventors (affiliation) |
CAMM Project Number |
CAMM Project Title |
BU Reference Number |
Options |
| Election Period Ends | |||||||
| 2 | September 9, 2008 | Interdigitated Microelectrode Array Devices on Glass and Flexible Polymer Substrates: Design, Fabrication & Assembly | C.J. Zhong; Jin Luo; Lingyan Wang (all BU) | CAMM0602 | Roll-to-Roll Fabrication of Flexible Sensor Arrays on Polymer | RB-263 |  |
| December 9, 2008 | |||||||
| 1 | August 11, 2008 | Printed Chip-to-Chip or Chip-to-Substrate Interconnect Using Inkjet Printing | Howard Wang; Bahgat Sammakia (both BU) | CAMM0601 | Materials and Processing for Inkjet Printing Fabrication of Flexible Electronics | RB-301 | |
| November 11, 2008 |
Reference Document
CAMM Intellecftual Property and Patent Policy (Exhibit B to the CAMM Member Agreement in place with Full and Affilliate Members)
Patents and Invention Policy of State University of New York (Exhibit C)
Presentations
Complementary Technologies Available for Licensing
Inventions made by BU scientists and engineers outside the scope of CAMM may also hold interest for Members. We highlight:
- Thermal Interposers with Nanostructures (RB-144)
- Protective Ceramic/SAM (Self- Assembled Monolayer) Bilayer Coatings(RB-159)
- Nanomaterials Construction of Thermal Interface Materials (RB-253)
Additional technologies are listed at http://research.binghamton.edu/Innovation/AvailableTechnologies.php
