Bahgat Sammakia has conducted and enabled research and collaborations that annually contribute $30 million to Greater Binghamton's economic base while providing important assistance to numerous corporate partners, including ADI, IBM, Universal Instruments, GE Corporate Research and Development and BAE Systems Controls.
Sammakia is director of the Small Scale Systems Integration and Packaging Center (S3IP), which is dedicated to innovations in solar energy, “green” data centers, flexible electronics and electronics packaging. He also serves as executive director of economic development and as director of the Integrated Electronics Engineering Center.
His work focuses on improving thermal management strategies in electronics packaging, and he is the principal investigator or co-principal investigator on millions of dollars of cross-disciplinary sponsored research. Sammakia, who holds more than a dozen U.S. patents, has published over 120 technical papers in refereed journals and conference proceedings and has contributed to several books on natural convection heat transfer and electronic packaging.
Sammakia, a professor of mechanical engineering, was named an Outstanding Researcher/Scholar by the Research Foundation of the State University of New York in 2008. He holds a doctorate from the State University of New York at Buffalo and worked for IBM for nearly 15 years before joining Binghamton’s faculty.
- Thermal Interposers (RB-144)
- Ceramic-Organic Bilayer Coatings(RB-159)
- Nano Thermal Interface Materials (RB-253)
- Micro-liter Mixing Module (RB-278)