DESCRIPTION:
This invention is a materials science solution to the challenge of power dissipation in high performance applications. This BU technology covers the system-level design, use and placement of Thermal Interface Materials (TIM) to overcome interfacial resistances due to the transition between different materials. The novel technology optimizes the heat flow path between the device and the heat sink and is suited for electronic devices needing rapid dissipation of heat such as computers, as well as for telecommunications, space, military and medical apparatus.
In contrast to typical TIM materials used in production today such as thermal greases and adhesives and low melt point solders such as Indium with thermal conductivity in the 3 to 30 W/mK range, carbon nanotubes (CNTs) may theoretically conduct between 6,000-8,000 W/mk. However, actual performance has been much lower due to low conductance at the interfaces between TIMs and solid surfaces. The current invention offers a novel TIM solution using a mechanically strong, chemically stable, hybrid materials system comprised of a matrix of aligned CNTs with deformable surfaces that form intimate contacts with deformable, metallic capping layers that are in contact with the die and the heat sink on the top and the bottom. The thickness and density of the CNT array within the mat (sheet) can be changed to match the heat dissipation needs of hot spots. This technology is compatible with current industry tooling which will facilitate adoption by manufacturers of system-level packages.
KEYWORDS:
Carbon nanotubes; metallic nanowires; thermal conductivity; deformable buffer layer; inkjet deposition
INVENTORS:
Dr. Howard Wang specializes in deposition engineering the self-assembly process to align CNTs in film matrices. Co-inventor Bahgat Sammakia holds 13 U.S. patents in heat transfer and electronics packaging and directs the New York State Center of Excellence for Small Scale Systems Integration and Packaging after a career in the microelectronics industry.
COMPLEMENTARY INVENTION:
Thermal Interposers with Nanostructures (RB-144)
AVAILABILITY:
RB-253 is available for licensing on an exclusive or non-exclusive basis.
PATENT STATUS:
Patent pending (U.S. Provisional Patent Application # 61/037,125, Filing Date: 3/17/08) |
