The Small Scale Systems Integration and Packaging Center maintains world class facilities and infrastructure on the Binghamton University campus and at the Huron Campus in Endicott, NY, devoted to research and development in microelectronics and supporting disciplines. Many of these facilities are available for use by our academic, non-profit and for-profit communities. For further information, please contact Center Associate Director at (607) 777-7270.
The Center is establishing new laboratory facilities that will answer New York State industry needs for instrumentation necessary to commercialize microelectronic applications. These facilities will provide expertise that will support materials diagnostics, analysis, and characterization studies for research in such areas as electronics systems integration and packaging, materials, and flexible electronics. The lab will also support life sciences research in medical diagnostics, security systems for pathogen detection, “smart textiles”, and additional industrial and consumer applications, both directly as well as through related emerging technologies.
This laboratory is funded with a $21M award from New York State as a High Technology Commercialization Center.
S3IP established the CAMM in 2005 with an award from the United States Display Consortium, an industrial consortium of over 80 members from the display industry. CAMM partners include Endicott Interconnect Technologies, Cornell University, the Army Research Lab, NASA and the Arizona State Flexible Display Center. The CAMM is currently the only center in the US conducting flexible electronics R&D in a roll-to-roll format. The roll-to-roll prototype manufacturing line will be available for research and development by academia and industrial partners under the CAMM User Program. http://camm.binghamton.edu
The Integrated Electronics Engineering Center The IEEC, a New York State Center for Advanced Technology, pursues research in electronics packaging. The IEEC administers laboratory facilities equipped for analyzing electronics packaging technology products. The facilities are useful for performing physical chemical, surface, and electronic analysis of products and materials. They are available for use by local small- and medium-sized businesses engaged in electronics packaging. The services provided include: