Electrical Reliability of 3D-printed Copper Conductor Lines

Authors: Oliver Trzcinski, Ping-Chuan Wang, Graham Werner

SUNY Campus: SUNY New Paltz

Presentation Type: Poster

Location: Old Union Hall

Presentation #: 32

Timeslot: Session C 1:45-2:45 PM

Abstract: Copper (Cu) is widely used in the electronics industry for its excellent electrical and thermal conductivities that are ideally suited for circuit and heat dissipation applications. For example, Cu has replaced aluminum to be the primary interconnect material in today’s microelectronics IC chips as an effective way to boost electrical performance. With the advancement in Cu fabrication using additive manufacturing (AM, also known as 3D-printing), it can be well expected that AM Cu will be adopted for manufacturing electrical circuits and components. In this research project, we study the metal degradation mechanism called “electromigration” in AM Cu conductor lines. Electromigration is the biased diffusion of metal atoms induced by the electron current. While Cu electromigration has been extensively investigated in the microelectronics industry, it has not been assessed in AM Cu which has very different microstructure. An experimental system has been developed to conduct electromigration stress on AM Cu conductor lines. Due to the relatively substantial dimensions of our specimens, the challenge of this project is to induce observable degradation within a practical timeframe. In this presentation, we discuss the strategies to maximize the acceleration of electromigration in the specimens, involving increased current and temperature within the thermal constraint. Additionally, as an effect of elevated temperature, Cu oxidation must be minimized. We will present the electrical test results, as well as the microscopy inspection of the physical failure to propose the degradation mechanism in AM Cu.