Teardowns of Consumer Products

Authors: Uwe Anselm, Cameron Kranz, Amr Bekhit, Jianpei Ma, Rafic Al-Ajam

Field of Study: Mechanical Engineering

Program Affiliation: Integrated Electronics Engineering Center

Faculty Mentors: William Blazey

Easel: 8

Timeslot: Morning

Abstract: This paper investigates the assemblies and layout of electronic chips. This study examines different dies to learn how new boards are designed. As technology advances, there is a greater need to inspect these chip architectures and die connections. This study includes experiments to make wire bonds visible in a die. It relies on microscopy, x-ray imaging, and cross-sectioning. Products provided to the university are torn down to the chip level. The chips are then examined using 2D or 3D X-ray imaging to identify areas of interest. A specific section of the board is then selected for cross-sectioning and cut out with the diamond saw. The cutout sections are potted up and made into samples. Once the samples have hardened, they will be ground down until the desired cross-section is visible and smooth. These samples are looked at through high magnification microscopes to be photographed and examined.