Development of Custom Fixtures for Advanced Materials Testing and Microfabrication Applications

Authors: Malcolm John, Morlidhar Patel

Field of Study: Mechanical Engineering

Program Affiliation: SCALE

Faculty Mentors: Junghyun Cho

Easel: 17

Timeslot: Morning

Abstract: Hybrid bonding of silicon chips with copper interconnects requires precise surface preparation and handling to ensure reliable performance. This work presents the design and fabrication of custom fixtures to support hybrid bonding process development in the Advanced Materials and Mechanics Laboratory at Binghamton University. 3D-printed compression fixtures were developed to simulate bonding preparation using glass substrates, representing silicon dioxide dielectric surfaces, and improving process consistency. In parallel, Teflon holders are being designed to support multiple silicon dies during electroless nickel immersion gold (ENIG) plating in acidic environments, increasing throughput compared to single-sample handling with tweezers. Additionally, Double Cantilever Beam (DCB) fixtures were fabricated for future interfacial fracture testing. These efforts demonstrate how custom tooling improves repeatability, efficiency, and scalability in hybrid bonding workflows.